super bright round type led lamps data sheet doc. no : qw0905- rev. : date : - 2005 18 - mar. a LVG12241 LVG12241 ligitek electronics co.,ltd. property of ligitek only
1/4 page LVG12241 part no. ligitek electronics co.,ltd. property of ligitek only package dimensions note : 1.all dimension are in millimeter tolerance is ? 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. directivity radiation 25.0min 0.5 typ 1.0min 2.54typ 5.3 1.0 1.5 max 4.0 50% 75% 100% x -60 -30 x 25% 0 25% 50% 75% 100% 0 x x 60 30 x 3.0
spectral halfwidth ??f nm peak wave length f pnm forward voltage @20ma(v) viewing angle 2 c 1/2 (deg) luminous intensity @20ma(mcd) lens green transparent note : 1.the forward voltage data did not including ? 0.1v testing tolerance. 2. the luminous intensity data did not including ? 15% testing tolerance. LVG12241 part no green gap material emitted color min. 2.6 30 1.7 565 max. min. 20 120 220 typ. symbol typical electrical & optical characteristics (ta=25 j ) absolute maximum ratings at ta=25 j peak forward current duty 1/10@10khz soldering temperature tsol power dissipation reverse current @5v operating temperature storage temperature t opr tstg pd ir forward current parameter i f i fp part no. max 260 j for 5 sec max -40 ~ +85 -40 ~ +100 100 10 j j mw g a vg 30 120 ratings unit ma ma ligitek el ectronics co.,ltd. property of ligitek only 2/4 page LVG12241
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( j ) relative intensity@20ma wavelength (nm) forward voltage@20ma normalize @25 j fig.4 relative intensity vs. temperature ambient temperature( j ) relative intensity@20ma normalize @25 j typical electro-optical characteristics current forward voltage(v) fig.1 forward current vs. forward voltage forward current(ma) forward current(ma) fig.2 relative intensity vs. forward current relative intensity normalize @20ma ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0 10 100 1000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40 -20 0 20 40 60 1.0 1.1 1.2 500 550 600 650 0.0 0.5 1.0 2.0 3.0 4.0 5.0 80 100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 vg chip 3.5 part no.LVG12241 page 3/4
part no. LVG12241 page 4/4 ligitek electronics co.,ltd. property of ligitek only reference standard mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 description test condition test item reliability test: 1.ta=105 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.ta=-40 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) the purpose of this is the resistance of the device which is laid under ondition of hogh temperature for hours. low temperature storage test high temperature storage test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, + 72hrs) operating life test this test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. mil-std-202:103b jis c 7021: b-11 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 1.ta=65 j? 5 j 2.rh=90 %~95 % 3.t=240hrs ? 2hrs 1.t.sol=260 j? 5 j 2.dwell time= 10 ? 1sec. 1.ta=105 j? 5 j &-40 j? 5 j (10min) (10min) 2.total 10 cycles the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. solder resistance test thermal shock test high temperature high humidity test 1.t.sol=230 j? 5 j 2.dwell time=5 ? 1sec solderability test this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this test is the resistance of the device under tropical for hous. this test intended to see soldering well performed or not.
|
